tl
ossales@fqpcb.com
+86 13489987611

HDI PCB

Mga detalye ng produkto: Model:1072 Layer: 6 Layer Stack-up: 1 N 1 Vias: Layer 1-6 sa pamamagitan ng vias; Layer 1-2, Layer5-6 na may 0.1mm blind vias; Layer 2-5 na may 0.2 mm na buried sa pamamagitan ng Trace width/space: min. 4mil/4mily

tingnan pa

High-Frequency Ceramic PCB

Mga detalye ng produkto: Material:RO4350B Layer:2- layer Surface:ENIG Application: High frequency Signal Receiver, 5G PCB

tingnan pa

Aluminum PCB

Mga Key Specifications: Material: TG ≥150℃, CTI ≥600V Aluminum substrate Cu na makapal: 4OZ (140 μm) PCB kapal: 2.0mm Surface: LFHAL Dielectric kapal: 100 μm Hi-Pot Withstand: 4KVDC (Aayon sa IPC-TM-650 2.5. 7.2 ) Thermal conductivity: ≥3.0 W/m. K Application: Motor control power board for Electric Vehicles

tingnan pa

Multi-layer PCB

Detalye ng produkto: Layer: 12 Layer Surface: Immersion gold surface finishing Board tockness: 2.4mm Solder mask: Green solder mask Iba: Multi-layer Circuit Boards, fine pitch board, disenyo ng BGA, makapal na PCB, impedance control PCB, RF board

tingnan pa

Double-sided PCB

Detalye ng produkto: Layer: 2 Layer Surface: OSP surface finishing Solder mask: Black solder mask Application: Consumer Electronics

tingnan pa

High-Speed PCB

Mga Key Specifications: Piniling materyal: TG ≥170 ℃, TU-933, mababang DK, high-speed Material Surface treatment: ENIG+Gold daliri Outline tolerance:+/-0.1mm (partial +/-0.05mm) Impedance control: 95+/-7% ohm Via disenyo:Laser drilling, Mechanical drilling Application:Service and data center optical modules

tingnan pa