I-HDI PCB

Imininingwane yomkhiqizo: Imodeli: 1072 Layer Stack-up: 1 N 1 Vias: Layer 1-6 nge-vias; Layer 1-2, Layer 5-6 enezimboni eziyi-0.1 mm; Layer 2-5 eno-0.2 mm engcwatshwe ngeTrace ububanzi / isikhala: min. 4mil / 4mill

I-Requency Ceramic PCB

I-aluminium PCB

Izinkcazelo ezikhiye: Izinto: TG ≥150℃, CTI ≥ 600 V Aluminium substrate Cu cu ukhulu: 4OZ (140 μm) Ubukhulu be-PCB: Ubukhulu obungu-2.0 mm: Ubukhulu be-LFHAL Dielectric: 100 μm Hi-Pot Withstand: I-4KVDC (Ngokusho kwe-IPC-TM-650 2.5. 7.2) Ukuqhuba okushisayo: ≥ 3.0 W / m. Uhlelo lwe-K: Ibhodi lamandla okulawula izimoto kagesi

I-PCB ye-multipler

Imininingwane yomkhiqizo: Layer: 12 Layer Surface: Immersion gold indawo yokuqeda ubukhulu beBhodi: 2.4 mm Solder mask: Imaski ye-salder eluhlaza Abanye: Ama-Multi-layer Circuit Boards, ibhodi elihle le-pitch, ukwakheka kwe-BGA, i-PCB ejiyile, i-impedance control PCB, ibhodi ye-RF

I-PCB ebhalwe kabili

I-PCB yejubane eliphakeme