Features |
Standard |
Advanced |
Material |
TG≥130℃, TG≥150℃,TG≥170℃ FR4; CTI≥600℃, Halogen free FR4,CAF resistance |
Special Material |
Ceramic Base, Aluminum Base, Rogers Base, Teflon Base, High-speed Material |
Maximum Layer Count |
20 |
30 |
Maximum PCB Size |
580*460mm [23*18"] |
580*530mm [23*21"] |
Minimum Inner Layer Trace/Spacing(0.5oz) |
3/3 mil |
2.5/2.5 mil |
Minimum Outer Layer Trace/Spacing(0.5oz) |
3/3 mil |
2.5/2.5 mil |
Maximum PCB Thickness |
3.6mm [0.142"] |
4.5mm [0.177"] |
Minimum PCB Thickness |
0.4mm [0.016"] |
0.2mm [0.008"] |
Minimum Mechancial Drill Size |
0.2mm [0.008"] |
0.1mm[0.004"] |
Minimum Laser Drill Size |
0.1mm [0.004"] |
0.08mm [0.003"] |
Maximum PCB Aspect Ratio |
8:01 |
12:01 |
Inner-layer Base Copper Weight |
0.5-12 oz |
0.5-12 oz |
Outer Layer Base Copper Weight |
0.5-14 oz |
0.5-14 oz |
Minimum Dielectric Thickness |
76µm [0.003"] |
50µm [0.002"] |
Minimum Solder Mask Dam |
100µm [0.004"] |
76µm [0.003"] |
Profile Tolerance |
± 150µm [0.006"] |
± 100µm [0.004"] |
Surface finishing |
ENIG, Gold Fingers, OSP, HASL with lead, Lead free HASL ... |
Special Surface |
Pealable Mask, Carbon Ink |