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Product details： Layer: 2 Layer Surface: OSP surface finishing Solder mask: Black solder mask Application: Consumer Electronics
Product details： Layer: 12 Layer Surface: Immersion gold surface finishing Board thickness: 2.4mm Solder mask: Green solder mask Others: Multi-layer Circuit Boards, fine pitch board, BGA design, thick PCB, impedance control PCB, RF board
Product details： Layer: 4 Layer Surface: ENIG, Gold edge plating Board thickness: 1.6 mm Solder mask: Green solder mask Application: Industrial Electronics Others: Multi-layer Circuit Boards, edge connectors
Product details： Layer: 14 Layer Surface: ENIG, Gold edge plating Solder mask: Green solder mask Others: Multi-layer boards, BGA design, fine pitch design
Product details： Model: 1072 Layer Counts: 6 Stacking: 1+N+1 Via: 1-6 layers of Through-vias, 1-2 layers, 5-6 layers with 0.1mm blind holes, 2-5 layers of 0.2mm buried holes. Trace Width/Spacing: 4mil/4mil
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Fuqiang Industrial Park, Qinghua Road, Rongqiao Economy Zone, Fuqing City, Fujian Province, China, 350301
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