Papua New Guinea Blind Buried Via PCB

Product details: Material: TG≥170 FR4 Board thickness: 2.4mm Layer: 6 layer Solder mask: LPI matte green Application: Power PCB Others: Blind and Buried Vias design

Category:

Papua New GuineaRigid PCB

Product Description

Material: TG≥170 FR4
Board thickness: 2.4mm
Layer: 6 layer
Solder mask: LPI matte green
Application: Power PCB
Others: Blind and Buried Vias design