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High-Density Interconnect PCB

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High-Density Interconnect PCB



Product Details

Explore the intricacies of circuits with our HDI (High-Density Interconnect) boards. Our seamless integration of microvias, blind vias, and buried vias allows us to achieve the required circuit density, ensuring exceptional quality for your electronic needs.


Technical Specifications:
Layer Count: Up to 12 layers 
Minimum Line/Spacing: 3/3 mils
Minimum Microvia Size: 0.076mm(Normally 0.1mm)
Aspect Ratio: 10:1
Material Options: FR-4, High-Tg, and more

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8-layer HDI PCB

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