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Product details： Layer: 12 Layer Solder mask: Green solder mask Application: Industrial Control Others: Multi-layer boards, Jump V-grooving design
Key Specifications: Material: TG≥150℃,CTI≥600V Aluminum substrate Cu thickness: 4OZ (140μm ) PCB thickness: 2.0mm Surface: LFHAL Dielectric thickness: 100μm Hi-Pot Withstand: 4KVDC （According to IPC-TM-650 2.5.7.2 ） Thermal conductivity: ≥3.0 W/m.K Application: Motor control power board for Electric Vehicles
Product details： Layer: 1 Layer Length: 1.2M Solder mask: White solder mask Application: LED Light Others: Extra Long PCB
Explore the intricacies of circuits with our HDI (High-Density Interconnect) boards. Our seamless integration of microvias, blind vias, and buried vias allows us to achieve the required circuit density, ensuring exceptional quality for your electronic needs. Technical Specifications: Layer Count: Up to 12 layers Minimum Line/Spacing: 3/3 mils Minimum Microvia Size: 0.076mm(Normally 0.1mm) Aspect Ratio: 10:1 Material Options: FR-4, High-Tg, and more
Product details： Model：U091 Layer：8 Layer Stack-up：2+N+2 Vias： Layer 1-2, layer 7-8 with 0.1mm blind vias (Just over the blind vias of layer 2-3, layer 6-7 ) Layer 2-3，layer 6-7 with 0.15mm blind vias Layer 3-4, layer 5-6 with 0.1mm buried vias Layer 2-7 with 0.2mm buried vias Trace width/space: Capable of producing 3/3mils
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Fuqiang Industrial Park, Qinghua Road, Rongqiao Economy Zone, Fuqing City, Fujian Province, China, 350301
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