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Product details： Material:TG≥170 FR4 Board thickness: 8.5mm Layer: 30 layer Solder mask: LPI glossy green Others: Ultra thick PCB
Product details： Material: TG≥170 FR4 Board thickness: 2.4mm Layer: 6 layer Solder mask: LPI matte green Application: Power PCB Others: Blind and Buried Vias design
Product details： Layer: 4 layer Solder mask: RED Solder mask Surface: ENIG surface finishing Application: Security Products
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