High-Density Interconnect PCB

Explore the intricacies of circuits with our HDI (High-Density Interconnect) boards. Our seamless integration of microvias, blind vias, and buried vias allows us to achieve the required circuit density, ensuring exceptional quality for your electronic needs. Technical Specifications: Layer Count: Up to 12 layers Minimum Line/Spacing: 3/3 mils Minimum Microvia Size: 0.076mm(Normally 0.1mm) Aspect Ratio: 10:1 Material Options: FR-4, High-Tg, and more

8-layer HDI PCB

Product details: Model:U091 Layer:8 Layer Stack-up:2+N+2 Vias: Layer 1-2, layer 7-8 with 0.1mm blind vias (Just over the blind vias of layer 2-3, layer 6-7 ) Layer 2-3,layer 6-7 with 0.15mm blind vias Layer 3-4, layer 5-6 with 0.1mm buried vias Layer 2-7 with 0.2mm buried vias Trace width/space: Capable of producing 3/3mils


Product details: Model:1072 Layer:6 Layer Stack-up:1+N+1 Vias: Layer 1-6 with through vias; Layer 1-2, Layer5-6 with 0.1mm blind vias; Layer 2-5 with 0.2mm buried vias Trace width/space: min. 4mil/4mil
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