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Explore the intricacies of circuits with our HDI (High-Density Interconnect) boards. Our seamless integration of microvias, blind vias, and buried vias allows us to achieve the required circuit density, ensuring exceptional quality for your electronic needs.
Technical Specifications:
Layer Count: Up to 12 layers
Minimum Line/Spacing: 3/3 mils
Minimum Microvia Size: 0.076mm(Normally 0.1mm)
Aspect Ratio: 10:1
Material Options: FR-4, High-Tg, and more
Product details：
Model：U091
Layer：8 Layer
Stack-up：2+N+2
Vias：
Layer 1-2, layer 7-8 with 0.1mm blind vias (Just over the blind vias of layer 2-3, layer 6-7 )
Layer 2-3，layer 6-7 with 0.15mm blind vias
Layer 3-4, layer 5-6 with 0.1mm buried vias
Layer 2-7 with 0.2mm buried vias
Trace width/space: Capable of producing 3/3mils
Product details：
Model：1072
Layer：6 Layer
Stack-up：1+N+1
Vias：
Layer 1-6 with through vias;
Layer 1-2, Layer5-6 with 0.1mm blind vias;
Layer 2-5 with 0.2mm buried vias
Trace width/space: min. 4mil/4mil
CONTACT US
Fuqiang Industrial Park, Qinghua Road, Rongqiao Economy Zone, Fuqing City, Fujian Province, China, 350301
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