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Product details：
Layer: 12 Layer
Solder mask: Green solder mask
Application: Industrial Control
Others: Multi-layer boards, Jump V-grooving design
Key Specifications:
Material: TG≥150℃,CTI≥600V Aluminum substrate
Cu thickness: 4OZ (140μm )
PCB thickness: 2.0mm
Surface: LFHAL
Dielectric thickness: 100μm
Hi-Pot Withstand: 4KVDC （According to IPC-TM-650 2.5.7.2 ）
Thermal conductivity: ≥3.0 W/m.K
Application: Motor control power board for Electric Vehicles
Product details：
Layer: 1 Layer
Length: 1.2M
Solder mask: White solder mask
Application: LED Light
Others: Extra Long PCB
Explore the intricacies of circuits with our HDI (High-Density Interconnect) boards. Our seamless integration of microvias, blind vias, and buried vias allows us to achieve the required circuit density, ensuring exceptional quality for your electronic needs.
Technical Specifications:
Layer Count: Up to 12 layers
Minimum Line/Spacing: 3/3 mils
Minimum Microvia Size: 0.076mm(Normally 0.1mm)
Aspect Ratio: 10:1
Material Options: FR-4, High-Tg, and more
Product details：
Model：U091
Layer：8 Layer
Stack-up：2+N+2
Vias：
Layer 1-2, layer 7-8 with 0.1mm blind vias (Just over the blind vias of layer 2-3, layer 6-7 )
Layer 2-3，layer 6-7 with 0.15mm blind vias
Layer 3-4, layer 5-6 with 0.1mm buried vias
Layer 2-7 with 0.2mm buried vias
Trace width/space: Capable of producing 3/3mils
CONTACT US
Fuqiang Industrial Park, Qinghua Road, Rongqiao Economy Zone, Fuqing City, Fujian Province, China, 350301
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