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Product details：
Layer: 12 Layer
Surface: Immersion gold surface finishing
Board thickness: 2.4mm
Solder mask: Green solder mask
Others: Multi-layer Circuit Boards, fine pitch board, BGA design, thick PCB, impedance control PCB, RF board
Product details：
Layer: 4 Layer
Surface: ENIG, Gold edge plating
Board thickness: 1.6 mm
Solder mask: Green solder mask
Application: Industrial Electronics
Others: Multi-layer Circuit Boards, edge connectors
Multi-layer Thick Copper Boards
Product details：
Material: TG180 FR4
Layer Counts: 6 layers
Board Thickness: 2.8MM
Copper Thickness: outer layer 70μm, inner layer 400μm
Surface: ENIG
Application: Power board, power amplifier
Product details：
Material: TG180 FR4
Layer: 10 layers
Board Thickness: 4.5MM
Copper Thickness: 6 * 105μm, 4 * 500μm, total copper thickness 2630μm
Surface: ENIG
Application: Power board, power amplifier
Product details：
Layer: 14 Layer
Surface: ENIG, Gold edge plating
Solder mask: Green solder mask
Others: Multi-layer boards, BGA design, fine pitch design
Product details：
Model: 1072
Layer Counts: 6
Stacking: 1+N+1
Via: 1-6 layers of Through-vias,
1-2 layers, 5-6 layers with 0.1mm blind holes,
2-5 layers of 0.2mm buried holes.
Trace Width/Spacing: 4mil/4mil
CONTACT US
Fuqiang Industrial Park, Qinghua Road, Rongqiao Economy Zone, Fuqing City, Fujian Province, China, 350301
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