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Product details:
Material:TG≥170 FR4
Board thickness: 8.5mm
Layer: 30 layer
Solder mask: LPI glossy green
Others: Ultra thick PCB
Product details:
Material: TG≥170 FR4
Board thickness: 2.4mm
Layer: 6 layer
Solder mask: LPI matte green
Application: Power PCB
Others: Blind and Buried Vias design
Product details:
Layer: 4 layer
Solder mask: RED Solder mask
Surface: ENIG surface finishing
Application: Security Products